According to renowned analyst Ming-Chi Kuo from TF Securities International, Apple is likely to introduce its own Wi-Fi and Bluetooth chips in the upcoming iPhone 17 series. This move is part of Apple’s strategy to develop more of its components internally, which aims to reduce reliance on third-party suppliers like Broadcom.
Plans for In-House Connectivity Chips
In a recent update shared on X (formerly Twitter), Kuo highlighted Apple’s ambition to decrease its dependence on Broadcom for more than 300 million chips that facilitate Wi-Fi and Bluetooth functionality across its devices. The iPhone 17 series is poised to be the first lineup to incorporate these custom chips, with Apple targeting the launch of additional products featuring this technology in the latter half of 2025.
Kuo noted that the new Wi-Fi and Bluetooth chips will be manufactured using TSMC’s 7nm process and will support the latest Wi-Fi 7 standards. The iPhone 17 series follows the iPhone 16, which debuted in September.
Future Developments in Chip Technology
This initiative is not limited to Wi-Fi and Bluetooth capabilities. Apple is also anticipated to unveil the fourth-generation iPhone SE model, which will include a custom 5G modem alongside a Broadcom chip for connectivity.
The new iPhone 17 series and other devices featuring Apple’s in-house connectivity chips are expected to launch in the second half of 2025. However, these devices may not yet include the new 5G modem.
Kuo further explained that while the Wi-Fi, Bluetooth, and 5G chips are distinct and produced using different processes at TSMC, their development timelines could overlap. He predicts that Apple intends to equip nearly all of its devices with its proprietary chips over the next three years, solidifying its goal of reducing reliance on external suppliers.
